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Precautions
■ Soldering Information
Reflow soldering
?
?
?
?
Reflow no more than once.
Adjust the amount of applied solder quantity to the product sidewall of the terminal
When designing the pcb, avoid placing traces or other connections under the sensor, as shown in the ‘Recommend Solder Pattern’ diagram
Set the reflow oven so that the temperature profile shown in the following chart is obtained for the upper surface of the product being soldered.
( ° C)
250
240 ° C MAX.
200
150
100
1 to 4 ° C/sec
1 to 4 ° C/sec
10 sec MAX.
60 sec MAX.
200 ° C
1 to 4 ° C/sec
165 ° C MAX.
50
120 sec MAX.
90 sec MAX.
25
Time
? Do not immerse the resin part of the sensor into the solder.
? The use of an infrared lamp can cause the temperature of the resin to rise too high. Test the soldering method under actual conditions and make
sure that the process is acceptable, because the impact on the junction between the device and the PCB varies depending upon the soldering
and cooling conditions.
Storage
Store the product under the following conditions:
Temperature: 5 to 30 ° C
Humidity: 70 % max.
To protect the product from the effects of humidity until the package is opened, dry-box storage is recommended.
Reflow soldering must be done within 4 8 hours after opening the aluminum-laminated bag, during which time the product must be stored between
5 ° C and 25 ° C at 60 % maximum humidity.
If it is necessary to store the product for more than 4 8 hours after opening the bag, use dry-box storage or reseal the products in the aluminum-
laminated bag with a commercially available desiccant. Then, store the sensors between 5 to 30 ° C at 70 % max. humidity, mounting them within 2
weeks.
Baking
If a product has remained packed in the aluminum-laminated bag for six months or more, or if more than 4 8 hours have lapsed since the bag was
opened, then bake the product under the following conditions before use:
125 ° C for 16 to 24 hours (max.)
Note: Do not bake the sensors while they are still in their bag. Temporarily mount them to the PCB or place them in metal trays prior to baking.
Subject the sensors to the baking process no more than once.
Cleaning Conditions
Recommended Solvents Ethyl alcohol, methyl alcohol, or isopropyl alcohol
Solvent Temperature
Immersion Time
Do not use ultrasonic cleaning.
45 ° C max
3 hours max
232
Photomicrosensor (Reflective)
EE-SY199
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